Two speel plates are soldered on the two sides of a copper plate. All plates have equal cross–section A each. The coefficient of thermal expansion of copper and steel are αC and αS and their Young’s moduli are YC and YS . The temperature of the plates is raised by t°C and plates retain their shape; the tension in the copper plate is
(1) \(\frac{AY_c+2Y_s}{2Y_cY_s(a_c-a_s)t}\)
(2) \(\frac{2AY_sY_c(a_c-a_s)t}{Y_c+2Y_s}\)
(3) \(\frac{AY_sY_c(a_c-a_s)t}{Y_c+2Y_s}\)
(4) \(\frac{AY_c+2Y_s}{2Y_cY_s(a_c+a_s)t}\)